Services

SMD Assembly

Whitman Products is capable of high placement rates by utilizing fast on-the-fly vision alignment including fine pitch. Our placement capability includes SOICs, QFPs, QFNs, DFNs, Leadless Devices, Micro BGAs, BGAs to 2.1 inch, Passives small as 0201, and Ball Pitch to .4mm. Our camera systems provide alignment and component inspection including measurement of all BGA and micro BGA balls.

Whitman Products Co. has designed our facility around flexibility. All of our equipment provides quick and easy change over including, full vision printing, large feeder capability and "state-of-the-art" full convection reflow equipment. No matter what your application, no-clean or water wash, our facility can accommodate your needs.

Thru Hole

Whitman Products Co. has the ability to fully automate your thru-hole applications with our high speed DIP & Axial equipment.

Component locators are used to insert radial and odd form components. We have over 30 years of thru-hole experience, this combined with our modern technology insures the highest quality and workmanship for complete customer satisfaction

Capabilities

SMT PCB Assembly

PCB Assembly
Quick Turn Prototype Assembly
Flex Circuit Assembly
Box Build and Mechanical Assembly
Cable Assembly
Systems Integration
Full Test Services
Ultra-Sonic Welding
Turnkey Contracts Available
MRP Management

Skills

Full Supply Chain Services
Experienced Program Management
Design for Manufacturability
Highly Trained Personnel
J-STD-001 Class 3 Soldering
RoHS and Lead Free
Inventory Management and Logistics
Warranty and Depot Repair
Conformal Coat

Quality

We are proud of our ability to deliver quick turnaround product that meets your high quality expectations. Our shop area is fully ESD compliant and we are dedicated to continued improvement to our facilities and manufacturing equipment.